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Special issue: International conference on thermal, mechanical & multiphysics simulation and experiments in micro- and nano-electronics and systems [EuroSimE2017]
W.D. van Driel, Artur Wymysłowski
Microelectronics reliability, ISSN 0026-2714, Nº. 87, 2018, págs. 321-321
A review on discoloration and high accelerated testing of optical materials in LED based-products
M. Yazdan Mehr, M.R. Toroghinejad, F. Karimzadeh, W.D. van Driel, G.Q. Zhang
Microelectronics reliability, ISSN 0026-2714, Nº. 81, 2018, págs. 136-142
M. Yazdan Mehr, M.R. Toroghinejad, F. Karimzadeh, W.D. van Driel, G.Q. Zhang
Microelectronics reliability, ISSN 0026-2714, Nº. 78, 2017, págs. 143-147
Color shift acceleration on mid-power LED packages
Guangjun Liu, W.D. van Driel, Xuejun Fan, Jiajie Fan, Cheng Qian, G.Q. Zhang
Microelectronics reliability, ISSN 0026-2714, Nº. 78, 2017, págs. 294-298
Lumen maintenance predictions for LED packages
W.D. van Driel, M. Schuld, B. Jacobs, F. Commissaris, J. van der Eyden, B. Hamon
Microelectronics reliability, ISSN 0026-2714, Nº. 62, 2016, págs. 39-44
Creep fatigue models of solder joints: A critical review
E.H. Wong, W.D. van Driel, A. Dasgupta, M. Pecht
Microelectronics reliability, ISSN 0026-2714, Nº. 59, 2016, págs. 1-12
Comparing drop impact test method using strain gauge measurements.
Y. Liu, F.J.H.G. Kessels, W.D. van Driel, J.A.S. Van Driel, F.L. Sun, G.Q. Zhang
Microelectronics reliability, ISSN 0026-2714, Vol. 49, Nº. 9-11, 2009, págs. 1299-1303
J.J.M. Zaal, H.P. Hochstenbach, W.D. van Driel, G.Q. Zhang
Microelectronics reliability, ISSN 0026-2714, Vol. 49, Nº. 8, 2009, págs. 846-852
Advances in the drop-impact reliability of solder joints for mobile applications.
E.H. Wong, S.K.W. Seah, W.D. van Driel, J.F.J.M. Caers, N. Owens, Y.-S. Lai
Microelectronics reliability, ISSN 0026-2714, Vol. 49, Nº. 2, 2009, págs. 139-149
Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP.
F. Sun, P. Hochstenbach, W.D. van Driel, G.Q. Zhang
Microelectronics reliability, ISSN 0026-2714, Vol. 48, Nº. 8-9, 2008, págs. 1167-1170
On chip�package stress interaction.
W.D. van Driel, D.G. Yang, G.Q. Zhang
Microelectronics reliability, ISSN 0026-2714, Vol. 48, Nº. 8-9, 2008, págs. 1268-1273
Packaging influences on the reliability of MEMS resonators.
J.J.M. Zaal, W.D. van Driel, S. Bendida, Q. Li, J.T.M. Van Beek, G.Q. Zhang
Microelectronics reliability, ISSN 0026-2714, Vol. 48, Nº. 8-9, 2008, págs. 1567-1571
Correlation studies for component level ball impact shear test and board level drop test.
E.H. Wong, R. Rajoo, S.K.W. Seah, C.S. Selvanayagam, W.D. van Driel, J.F.J.M. Caers, X.J. Zhao, N. Owens, L.C. Tan, M. Leoni, P.L. Eu, Y.-S. Lai, C.-L. Yeh
Microelectronics reliability, ISSN 0026-2714, Vol. 48, Nº. 7, 2008, págs. 1069-1078
The need for multi-scale approaches in Cu/low-k reliability issues.
C.A. Yuan, O. van der Sluis, W.D. van Driel, G.Q. Zhang
Microelectronics reliability, ISSN 0026-2714, Vol. 48, Nº. 6, 2008, págs. 833-842
Characterization of semiconductor interfaces using a modified mixed mode bending apparatus.
J. Thijsse, O. van der Sluis, J.A.W. van Dommelen, W.D. van Driel, M.G.D. Geers
Microelectronics reliability, ISSN 0026-2714, Vol. 48, Nº. 3, 2008, págs. 389-394
Facing the challenge of designing for Cu/low-k reliability.
W.D. van Driel
Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 12, 2007, págs. 1969-1974
O. van der Sluis, R.A.B. Engelen, R.B.R. Van Silfhout, W.D. van Driel, M.A.J. van Gils
Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 12, 2007, págs. 1975-1982
Measuring the through-plane elastic modulus of thin polymer films in situ.
M. van Soestbergen, L.J. Ernst, K.M.B. Jansen, W.D. van Driel
Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 12, 2007, págs. 1983-1988
Molecular simulation on the material/interfacial strength of the low-dielectric materials.
C.A. Yuan, O. van der Sluis, G.Q. Zhang (Kouchi), L.J. Ernst, W.D. van Driel, R.B.R. Van Silfhout
Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 9-11, 2007, págs. 1483-1491
Characterization of moisture properties of polymers for IC packaging.
X. Ma, K.M.B. Jansen, L.J. Ernst, W.D. van Driel, O. van der Sluis, G.Q. Zhang
Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 9-11, 2007, págs. 1685-1689
Mechanical reliability challenges for MEMS packages: Capping.
W.D. van Driel, D.G. Yang, C.A. Yuan, M. Van Kleef, G.Q. Zhang
Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 9-11, 2007, págs. 1823-1826
Advanced structural similarity rules for the BGA package family.
W.D. van Driel, A. Mavinkurve, M.A.J. van Gils, G.Q. Zhang
Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 2-3, 2007, págs. 205-214
Virtual qualification of moisture induced failures of advanced packages.
M.A.J. van Gils, W.D. van Driel, G.Q. Zhang, H.J.L. Bressers, R.B.R. van Shilfhout, X.J. Fan
Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 2-3, 2007, págs. 273-279
A. Wymyslowski, W.D. van Driel, J. van de Peer, N. Tzannetakis, G.Q. Zhang
Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 2-3, 2007, págs. 280-289
Correlation between chemistry of polymer building blocks and microelectronics reliability.
H.J.L. Bressers, W.D. van Driel, K.M.B. Jansen, L.J. Ernst, G.Q. Zhang
Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 2-3, 2007, págs. 290-294
Numerical modeling of warpage induced in QFN array molding process
D.G. Yang, K.M.B. Jansen, L.J. Ernst, G.Q. Zhang, W.D. van Driel, H.J.L. Bressers, J.H.J. Janssen
Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 2-3, 2007, págs. 310-318
J. W. C. de Vries, M.Y. Jansen, W.D. van Driel
Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 2-3, 2007, págs. 444-449
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