Microelectronics reliability

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  Año 2018, Número 87

  • An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method

    Kenneth Chimezie Nwanoro, Hua Lu, Chunyang Yin, Chris Bailey

    • Resumen

    págs. 1-14

    

  • An efficient NBTI sensor and compensation circuit for stable and reliable SRAM cells

    Ambika Prasad Shah, Nandakishor Yadav, Ankur Beohar, Santosh Kumar Vishvakarma

    • Resumen

    págs. 15-23

    

  • Modeling and analysis of single-event transient sensitivity of a 65 nm clock tree

    Yuanqing Li, Li Chen, Issam Nofal, Mo Chen, Haibin Wang, Rui Liu, Qingyu Chen, Miloš Krstić, Shuting Shi, Gang Guo, Sang H. Baeg, ShiJie Wen, Richard Wong

    • Resumen

    págs. 24-32

    

  • A new hierarchical belief-rule-based method for reliability evaluation of wireless sensor network

    Wei He, Guan-Yu Hu, Zhi-Jie Zhou, Pei-Li Qiao, Xiaoxia Han, Yuan-Yuan Qu, Hang Wei, Chun Shi

    • Resumen

    págs. 33-51

    

  • Asymmetric resistive switching behaviour in a Au/a-C: Co/Au planar structure

    D. Zhang, T.R. Li, J.W. Zhou, Y.C. Jiang, Bing Ren, Y.J. Huang, J.M. Zhang, L. Wang, J. Gao, L.J. Wang

    • Resumen

    págs. 52-56

    

  • Source engineering on ruggedness and RF performance of n-channel RFLDMOS

    Hao Li, Mifang Cong, Ke Li, Huan Du

    • Resumen

    págs. 57-63

    

  • Adaptive and robust prediction for the remaining useful life of electrolytic capacitors

    Qi Qin, Shuai Zhao, Shaowei Chen, Dengshan Huang, Jiang Liang

    • Resumen

    págs. 64-74

    

  • Effect of solder resist dissolution on the joint reliability of ENIG surface and Sn–Ag–Cu solder

    Hyunju Lee, Cheolmin Kim, Cheolho Heo, Chiho Kim, Jae-Ho Lee, Yangdo Kim

    • Resumen

    págs. 75-80

    

  • A comprehensive solution for electronic packages' reliability assessment with digital image correlation (DIC) method

    Yuling Niu, Jing Wang, Shuai Shao, Huayan Wang, Hohyung Lee, S.B. Park

    • Resumen

    págs. 81-88

    

  • Multiple heat path dynamic thermal compact modeling for silicone encapsulated LEDs

    A. Alexeev, G. Martín, G. Onushkin

    • Resumen

    págs. 89-96

    

  • Enhanced Cu pillar design to reduce thermomechanical stress induced during flip chip assembly

    Melina Lofrano, Vladimir Cherman, Mario González, Eric Beyne

    • Resumen

    págs. 97-105

    

  • New NBTI models for degradation and relaxation kinetics valid over extended temperature and stress/recovery ranges

    D. Nouguier, X. Federspiel, G. Ghibaudo, M. Rafik, D. Roy

    • Resumen

    págs. 106-112

    

  • Sensor system optimization to meet reliability targets

    Wolfgang Granig, Lisa-Marie Faller, Hubert Zangl

    • Resumen

    págs. 113-124

    

  • Fatigue measurement setup under combined thermal and vibration loading on electronic SMT assembly

    Karsten Meier, René Metasch, Mike Roellig, Karlheinz Bock

    • Resumen

    págs. 125-132

    

  • Enhancing the ductility and mechanical behavior of Sn-1.0Ag-0.5Cu lead-free solder by adding trace amount of elements Ni and Sb

    A.E. Hammad

    • Resumen

    págs. 133-141

    

  • A simple metal-semiconductor substructure for the advanced thermo-mechanical numerical modeling of the power integrated circuits

    Adrian Bojita, Cristian Boianceanu, Marius Purcar, Ciprian Florea, Dan Simon, Cosmin-Sorin Plesa

    • Resumen

    págs. 142-150

    

  • Single-event multiple transients in guard-ring hardened inverter chains of different layout designs

    Wen Zhao, Chaohui He, Wei Chen, Rongmei Chen, Peitian Cong, Fengqi Zhang, Zujun Wang, Chen Shen, Lisang Zheng, Xiaoqiang Guo, Lili Ding

    • Resumen

    págs. 151-157

    

  • Impact and mitigation of SRAM read path aging

    Innocent Agbo, Mottaqiallah Taouil, Daniël Kraak, Said Hamdioui, Pieter Weckx, Stefan Cosemans, Francky Catthoor, Wim Dehaene

    • Resumen

    págs. 158-167

    

  • IGBT junction and coolant temperature estimation by thermal model

    Wu Zhihong, Su Xiezu, Zhu Yuan

    • Resumen

    págs. 168-182

    

  • Reliability analysis of an integrated device of ECG, PPG and pressure pulse wave for cardiovascular disease

    Weichao Liu, Xiang Fang, Qianqian Chen, Yingxin Li, Ting Li

    • Resumen

    págs. 183-187

    

  • Performance assessment of the NIRS-based medical system of evaluating therapeutic effect

    Ke Zhao, Nanxi Li, Boan Pan, Ting Li

    • Resumen

    págs. 188-193

    

  • Versatile MOR-based boundary condition independent compact thermal models with multiple heat sources

    Lorenzo Codecasa, Robin Bornoff, James Dyson, Vincenzo d'Alessandro, Alessandro Magnani, Niccolò Rinaldi

    • Resumen

    págs. 194-205

    

  • Application of expectation maximization and Kalman smoothing for prognosis of lumen maintenance life for light emitting diodes

    Pham Luu Trung Duong, Hyunseok Park, Nagarajan Raghavan

    • Resumen

    págs. 206-212

    

  • Thermal annealing studies in epitaxial 4H-SiC Schottky barrier diodes over wide temperature range

    P. Vigneshwara Raja, N. V. L. N. Murty

    • Resumen

    págs. 213-221

    

  • Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization

    Brice Rogié, Lorenzo Codecasa, Eric Monier-Vinard, Valentin Bissuel, Najib Laraqi, Olivier Daniel, Dario D'Amore, Alessandro Magnani, Vincenzo d'Alessandro, Niccolò Rinaldi

    • Resumen

    págs. 222-231

    

  • Novel silver die-attach technology on silver pre-sintered DBA substrates for high temperature applications

    Shuji Nishimoto, Seyed Ali Moeini, Toyo Ohashi, Yoshiyuki Nagatomo, Patrick McCluskey

    • Resumen

    págs. 232-237

    

  • Investigations of the impact of initial stresses on fracture and delamination risks of an avionics MEMS pressure sensor

    J. Auersperg, E. Auerswald, C. Collet, Th. Dean, D. Vogel, Th. Winkler, Sven Rzepka

    • Resumen

    págs. 238-244

    

  • Novel thermal model of microchannel cooling system designed for fast simulation of liquid-cooled ICs

    Piotr Zając, Andrzej K. T. Napieralski

    • Resumen

    págs. 245-258

    

  • Temperature effects on BTI and soft errors in modern logic circuits

    W. Sootkaneung, S. Howimanporn, S. Chookaew

    • Resumen

    págs. 259-270

    

  • From chip to inverter: Electro-thermal modeling and design for paralleled power devices in high power application

    Peng Fan, Shoudao Huang, Huai Wang, Huimin Li, Derong Luo

    • Resumen

    págs. 271-277