Periodo de publicación recogido
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Electromigration on void formation of Sn3Ag1.5Cu FCBGA solder joints.
M.-H.R. Jen, L.-C. Liu, Y.-S. Lai
Microelectronics reliability, ISSN 0026-2714, Vol. 49, Nº. 7, 2009, págs. 734-745
Recent research advances in Pb-free solders.
Y.-S. Lai, H.-M. Tong, K.-N. Tu
Microelectronics reliability, ISSN 0026-2714, Vol. 49, Nº. 3, 2009
Alloying modification of Sn�Ag�Cu solders by manganese and titanium.
L.-W. Lin, J.-M. Song, Y.-S. Lai, Y.-T. Chiu, N.-C. Lee, J.-Y Uan
Microelectronics reliability, ISSN 0026-2714, Vol. 49, Nº. 3, 2009, págs. 235-241
Towards elastic anisotropy and strain-induced void formation in Cu�Sn crystalline phases.
J. Chen, Y.-S. Lai
Microelectronics reliability, ISSN 0026-2714, Vol. 49, Nº. 3, 2009, págs. 264-268
S.T. Jenq, H.-H. Chang, Y.-S. Lai, T.-Y. Tsai
Microelectronics reliability, ISSN 0026-2714, Vol. 49, Nº. 3, 2009, págs. 310-317
Advances in the drop-impact reliability of solder joints for mobile applications.
E.H. Wong, S.K.W. Seah, W.D. van Driel, J.F.J.M. Caers, N. Owens, Y.-S. Lai
Microelectronics reliability, ISSN 0026-2714, Vol. 49, Nº. 2, 2009, págs. 139-149
Finite element model verification for packaged printed circuit board by experimental modal analysis.
Y.-C. Lee, B.-T. Wang, Y.-S. Lai, C.-L. Yeh, R.-S. Chen
Microelectronics reliability, ISSN 0026-2714, Vol. 48, Nº. 11-12, 2008, págs. 1837-1846
Correlation studies for component level ball impact shear test and board level drop test.
E.H. Wong, R. Rajoo, S.K.W. Seah, C.S. Selvanayagam, W.D. van Driel, J.F.J.M. Caers, X.J. Zhao, N. Owens, L.C. Tan, M. Leoni, P.L. Eu, Y.-S. Lai, C.-L. Yeh
Microelectronics reliability, ISSN 0026-2714, Vol. 48, Nº. 7, 2008, págs. 1069-1078
Structural design optimization for board-level drop reliability of wafer-level chip-scale packages.
T.-Y. Tsai, Y.-S. Lai, C.-L. Yeh, R.-S. Chen
Microelectronics reliability, ISSN 0026-2714, Vol. 48, Nº. 5, 2008, págs. 757-762
Characteristics of ZnO thin films prepared by radio frequency magnetron sputtering.
P.-F. Yang, H.C. Wen, S.-R. Jian, Y.-S. Lai, S. Wu, R.-S. Chen
Microelectronics reliability, ISSN 0026-2714, Vol. 48, Nº. 3, 2008, págs. 389-394
Effects of different drop test conditions on board-level reliability of chip-scale packages.
Y.-S. Lai, P.C. Yang, C.-L. Yeh
Microelectronics reliability, ISSN 0026-2714, Vol. 48, Nº. 2, 2008, págs. 274-281
C.-L. Yeh, Y.-S. Lai
Microelectronics reliability, ISSN 0026-2714, Vol. 48, Nº. 2, 2008, págs. 282-292
T.H. Wang, Y.-S. Lai, Y.-C. Lin
Microelectronics reliability, ISSN 0026-2714, Vol. 48, Nº. 1, 2008, págs. 132-139
Evaluation of solder joint strengths under ball impact test.
Y.-S. Lai, H.-C. Chang, C.-L. Yeh
Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 12, 2007, págs. 2179-2187
T.-Y. Tsai, C.-L. Yeh, Y.-S. Lai, R.-S. Chen
Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 8, 2007, págs. 1239-1245
Empirical correlation between package-level ball impact test and board-level drop reliability.
C.-L. Yeh, Y.-S. Lai, H.-C. Chang, T.-H. Chen
Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 7, 2007, págs. 1127-1134
Y.-S. Lai, T.H. Wang
Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 1, 2007, págs. 104-110
Cyclic bending reliability of wafer-level chip-scale packages.
Y.-S. Lai, T.H. Wang, T.H. Tsai, M.-H.R. Jen
Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 1, 2007, págs. 111-117
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