págs. 1-10
Single Event Upset rate determination for 65 nm SRAM bit-cell in LEO radiation environments
Muhammad Sajid, N.G. Chechenin, Frank Sill Torres, Usman Ali Gulzari, Muhammad Usman Butt, Zhu Ming, E.U. Khan
págs. 11-16
Synthesis of SnAgCu nanoparticles with low melting point by the chemical reduction method
Yang Wang, Wenxiao Liu, Wei Liu, Peng He, Zhonghua Fan, Xiaohong Wang, Dingkun Yu, Jiayu Guo, Bing Guo, Hangyan Shen
págs. 17-24
págs. 25-37
D. Malagón, Sebastià A. Bota, G. Torrens, X. Gili, Antonio Javier Praena Rodríguez, B. Fernández, M. Macías, José Manuel Quesada Molina, Carlos Guerrero Sanchez, M. C. Jiménez, J. García López, J. L. Merino, J. Segura
págs. 38-45
A novel multiple-stress-based predictive model of LEDs for rapid lifetime estimation
Su-Dan Huang, Lin Zhou, Guang-Zhong Cao, Huai-Yuan Liu, Yi-Min Hu, Gang Jing, Ming-Gao Cao, Wen-Peng Xiao, Yan Liu
págs. 46-52
págs. 53-64
págs. 65-71
págs. 72-79
págs. 80-84
Estimating the SEU failure rate of designs implemented in FPGAs in presence of MCUs
Igor Villalta, Unai Bidarte Peraita, Julen Gomez-Cornejo Barrena, Jesus Lazaro Sanz, Armando Astarloa Cuellar
págs. 85-92
Effects of thermal aging on Cu nanoparticle/Bi-Sn solder hybrid bonding
M. Usui, T. Satoh, Hidehiko Kimura, S. Tajima, Y. Hayashi, D. Setoyama, Masashi Kato
págs. 93-99
págs. 100-110
Using nanoindentation to investigate the temperature cycling of Sn37Pb solders
Hua-Chiang Wen, Wu-Ching Chou, Po-Chen Lin, Yeau-Ren Jeng, Chien-Chang Chen, Hung Ming Chen, Don Son Jiang, Chun-Hu Cheng
págs. 111-117
págs. 118-125
págs. 126-130
págs. 131-142
págs. 143-147
Analysis of multifinger power HEMTs supported by effective 3-D device electrothermal simulation
Aleš Chvála, Juraj Marek, Patrik Príbytný, Alexander Šatka, Steve Stoffels, Niels Posthuma, Stefaan Decoutere, Daniel Donoval
págs. 148-155
págs. 156-160
Goran S. Nikolic, M.K. Stojcev, T.R. Nikolic, Branislav D. Petrovic, Goran S. Jovanovic, Bojan R. Dimitrijevic
págs. 161-180
págs. 181-189
Towards high-sensitive built-in current sensors enabling detection of radiation-induced soft errors
Raphael de Oliveira Rocha, Frank Sill Torres, R. Possamai Bastos
págs. 190-196
Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component
Hongyu Tang, Huaiyu Ye, Cell K.Y. Wong, Stanely Y.Y. Leung, Jiajie Fan, Xiangping Chen, Xuejun Fan, Guoqi Zhang
págs. 197-204
págs. 205-211
págs. 212-219
Adhesion of NCF to oxidized Si wafers after oxygen plasma treatment
Min-Seok Jang, Sung Woo Ma, Jongsoo Song, Myungmo Sung, Young-Ho Kim
págs. 220-226
págs. 227-232
Vincenzo d'Alessandro, Antonio Pio Catalano, Alessandro Magnani, Lorenzo Codecasa, Niccolò Rinaldi, Brian Moser, P. J. Zampardi
págs. 233-242
págs. 243-248
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