Periodo de publicación recogido
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Color shift acceleration on mid-power LED packages
Guangjun Liu, W.D. van Driel, Xuejun Fan, Jiajie Fan, Cheng Qian, G.Q. Zhang
Microelectronics reliability, ISSN 0026-2714, Nº. 78, 2017, págs. 294-298
Comparing drop impact test method using strain gauge measurements.
Y. Liu, F.J.H.G. Kessels, W.D. van Driel, J.A.S. Van Driel, F.L. Sun, G.Q. Zhang
Microelectronics reliability, ISSN 0026-2714, Vol. 49, Nº. 9-11, 2009, págs. 1299-1303
Numerical prediction of failure paths at a roughened metal/polymer interface.
S.P.M. Noijen, O. van der Sluis, P.H.M. Timmermans, G.Q. Zhang
Microelectronics reliability, ISSN 0026-2714, Vol. 49, Nº. 9-11, 2009, págs. 1315-1318
J.J.M. Zaal, H.P. Hochstenbach, W.D. van Driel, G.Q. Zhang
Microelectronics reliability, ISSN 0026-2714, Vol. 49, Nº. 8, 2009, págs. 846-852
Numerical analysis of delamination and cracking phenomena in multi-layered flexible electronics.
O. van der Sluis, R.A.B. Engelen, P.H.M. Timmermans, G.Q. Zhang
Microelectronics reliability, ISSN 0026-2714, Vol. 49, Nº. 8, 2009, págs. 853-860
Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP.
F. Sun, P. Hochstenbach, W.D. van Driel, G.Q. Zhang
Microelectronics reliability, ISSN 0026-2714, Vol. 48, Nº. 8-9, 2008, págs. 1167-1170
On chip�package stress interaction.
W.D. van Driel, D.G. Yang, G.Q. Zhang
Microelectronics reliability, ISSN 0026-2714, Vol. 48, Nº. 8-9, 2008, págs. 1268-1273
Failure analysis of a thin-film nitride MEMS package.
Q. Li, J.F.L. Goosen, J.T.M. Van Beek, F. Van Keulen, K.L. Phan, G.Q. Zhang
Microelectronics reliability, ISSN 0026-2714, Vol. 48, Nº. 8-9, 2008, págs. 1557-1561
Packaging influences on the reliability of MEMS resonators.
J.J.M. Zaal, W.D. van Driel, S. Bendida, Q. Li, J.T.M. Van Beek, G.Q. Zhang
Microelectronics reliability, ISSN 0026-2714, Vol. 48, Nº. 8-9, 2008, págs. 1567-1571
The need for multi-scale approaches in Cu/low-k reliability issues.
C.A. Yuan, O. van der Sluis, W.D. van Driel, G.Q. Zhang
Microelectronics reliability, ISSN 0026-2714, Vol. 48, Nº. 6, 2008, págs. 833-842
Characterization of moisture properties of polymers for IC packaging.
X. Ma, K.M.B. Jansen, L.J. Ernst, W.D. van Driel, O. van der Sluis, G.Q. Zhang
Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 9-11, 2007, págs. 1685-1689
Mechanical reliability challenges for MEMS packages: Capping.
W.D. van Driel, D.G. Yang, C.A. Yuan, M. Van Kleef, G.Q. Zhang
Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 9-11, 2007, págs. 1823-1826
Analysis of Cu/low-k bond pad delamination by using a novel failure index.
M.A.J. van Gils, O. van der Sluis, G.Q. Zhang, J.H.J. Janssen, R.M.J. Voncken
Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 2-3, 2007, págs. 179-186
Advanced structural similarity rules for the BGA package family.
W.D. van Driel, A. Mavinkurve, M.A.J. van Gils, G.Q. Zhang
Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 2-3, 2007, págs. 205-214
Effect of filler concentration of rubbery shear and bulk modulus of molding compounds.
D.G. Yang, K.M.B. Jansen, L.J. Ernst, G.Q. Zhang, H.J.L. Bressers, J.H.J. Janssen
Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 2-3, 2007, págs. 233-239
Virtual qualification of moisture induced failures of advanced packages.
M.A.J. van Gils, W.D. van Driel, G.Q. Zhang, H.J.L. Bressers, R.B.R. van Shilfhout, X.J. Fan
Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 2-3, 2007, págs. 273-279
Correlation between chemistry of polymer building blocks and microelectronics reliability.
H.J.L. Bressers, W.D. van Driel, K.M.B. Jansen, L.J. Ernst, G.Q. Zhang
Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 2-3, 2007, págs. 290-294
Numerical modeling of warpage induced in QFN array molding process
D.G. Yang, K.M.B. Jansen, L.J. Ernst, G.Q. Zhang, W.D. van Driel, H.J.L. Bressers, J.H.J. Janssen
Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 2-3, 2007, págs. 310-318
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