págs. 159-161
págs. 161-167
Investigations of the influence of dicing techniques on the strength properties of thin silicon.
S. Schoenfelder, M. Ebert, C. Landesberger, K. Bock, J. Bagdahn
págs. 168-178
Analysis of Cu/low-k bond pad delamination by using a novel failure index.
M.A.J. van Gils, O. van der Sluis, G.Q. Zhang, J.H.J. Janssen, R.M.J. Voncken
págs. 179-186
Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept.
M. Roellig, R. Dudek, S. Wiese, B. Boehme, B. Wunderle, K.-J. Wolter, B. Michel
págs. 187-195
págs. 196-204
págs. 205-214
págs. 215-222
págs. 223-232
Effect of filler concentration of rubbery shear and bulk modulus of molding compounds.
D.G. Yang, K.M.B. Jansen, L.J. Ernst, G.Q. Zhang, H.J.L. Bressers, J.H.J. Janssen
págs. 233-239
Novel shear tools for viscoelastic characterization of packaging polymers.
C. van't Hof, K.M.B. Jansen, G. Wisse, L.J. Ernst, D.G. Yang, G.Q. Zhang, H.J.L. Bressers
págs. 240-247
Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques.
V. Gonda, K.M.B. Jansen, L.J. Ernst, J. den Toonder, G.Q. Zhang
págs. 248-251
págs. 252-258
págs. 259-265
págs. 266-272
Virtual qualification of moisture induced failures of advanced packages.
M.A.J. van Gils, W.D. van Driel, G.Q. Zhang, H.J.L. Bressers, R.B.R. van Shilfhout, X.J. Fan
págs. 273-279
págs. 280-289
Correlation between chemistry of polymer building blocks and microelectronics reliability.
H.J.L. Bressers, W.D. van Driel, K.M.B. Jansen, L.J. Ernst, G.Q. Zhang
págs. 290-294
págs. 295-301
págs. 302-309
Numerical modeling of warpage induced in QFN array molding process
D.G. Yang, K.M.B. Jansen, L.J. Ernst, G.Q. Zhang, W.D. van Driel, H.J.L. Bressers, J.H.J. Janssen
págs. 310-318
págs. 319-326
pág. 327
págs. 328-330
Inkjettable conductive adhesive for use in microelectronics and microsystems technology.
J. Kolbe, A. Arp, F. Calderone, W. Meyer, H. Schaefer, M. Stuve
págs. 331-334
págs. 335-341
págs. 342-346
págs. 347-353
págs. 354-362
págs. 363-371
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