Comparison study on microstructure and mechanical properties of Sn-10Bi and Sn-Ag-Cu solder alloys and joints

• Autores: Qinhan Guo, Zhenjiang Zhao, Chunlong Shen
• Localización: Microelectronics reliability, ISSN 0026-2714, Nº. 78, 2017, págs. 72-79
• Idioma: inglés
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• Resumen

  • Abstract The comparison study of Sn-10Bi and Sn-3.0Ag-0.5Cu solder alloys and joints was conducted. The results showed that the liquidus of Sn-10Bi solder alloy was lower than that of Sn-Ag-Cu slightly. The interfacial IMCs layer growth of Sn-10Bi/Cu was slower than that of Sn-Ag-Cu/Cu during liquid/solid reaction. The higher strength and lower creep strain rate of Sn-10Bi comparing with that of Sn-Ag-Cu were contributed by the solid solution strengthening effect of Bi atom in β-Sn phase. The ultimate bending load of Sn-10Bi joint was higher than that of Sn-Ag-Cu joint as the high strength of Sn-10Bi solder alloy. Moreover, the thinner and more flat IMCs layer also ensured the stable maximum bending displacement of Sn-10Bi joint at a loading speed of 1 mm/s compared with that of Sn-Ag-Cu joint.