Probabilistic fatigue damage estimation of embedded electronic solder joints under random vibration
Mayssam Jannoun, Younes Aoues, Emmanuel Pagnacco, Philippe Pougnet, Abdelkhalak El-Hami
págs. 249-257
págs. 258-266
Effect of body bias and temperature on low-frequency noise in 40-nm nMOSFETs
Hsien-Chin Chiu, Min-Li Chou, Chun-Hu Cheng, Hsuan-Ling Kao, Cheng-Lin Cho
págs. 267-271
págs. 272-279
págs. 280-284
págs. 285-293
Color shift acceleration on mid-power LED packages
Guangjun Liu, W.D. van Driel, Xuejun Fan, Jiajie Fan, Cheng Qian, G.Q. Zhang
págs. 294-298
págs. 299-306
A novel vertical SCR for ESD protection in 40 V HV bipolar process
Fan Liu, Zhiwei Liu, Jizhi Liu, Hui Cheng, Liu Zhao, Rui Tian, Shiyu Song, Juin J. Liou
págs. 307-310
págs. 311-318
págs. 319-330
TSV by 355 UV laser for 4G component packaging with micro-electroforming
C.T. Pan, Y.C. Chen, S.Y. Wang, Y.-T. Cheng, C.K. Yen, Y. L. Lin, W.-C. Shih
págs. 331-338
Effect of ENEPIG metallization for solid-state gold-gold diffusion bonds
Kelvin P.L. Pun, Navdeep S. Dhaka, Chee-wah Cheung, Alan H.S. Chan
págs. 339-348
Estimating the Single-Event Upset sensitivity of a memory array using simulation
Mélanie Raine, Marc Gaillardin, Thierry Lagutere, Olivier Duhamel, Philippe Paillet
págs. 349-354
págs. 355-361
A comparative study on electrothermal characteristics of nanoscale multiple gate MOSFETs
Qi-Lin Gu, Peng Zhang, Yi Ru, Hao Song, Wen-Sheng Zhao, Wen-Yan Yin
págs. 362-369
págs. 370-373
págs. 374-378
Thermal characterization of multicolor LED luminaire
A.M. Colaco, C.P. Kurian, Savitha G. Kini, S.G. Colaco, Cherian Johny
págs. 379-388
págs. 389-395
págs. 396-400
págs. 401-405
págs. 406-410
págs. 411-414
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