Microelectronics reliability

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  Año 2018, Número 84

  • Reliability comparison of 28 V–50 V GaN-on-SiC S-band and X-band technologies

    Donald A. Gajewski, Satyaki Ganguly, Scott S. Sheppard, Simon Wood, Jeff B. Barner, Jim Milligan, John Palmour

    • Resumen

    págs. 1-6

    

  • Reliable real-time task scheduler based on Rocket Queue architecture

    L. Kohútka, Viera Stopjaková

    • Resumen

    págs. 7-19

    

  • A double snapback SCR ESD protection scheme for 28 nm CMOS process

    Tao Hu, Shurong Dong, Hao Jin, Hei Wong, Zekun Xu, Xiang Li, Juin J. Liou

    • Resumen

    págs. 20-25

    

  • Signal characteristic and test exploitation for intermittent nanometer-scale cracks

    Hosung Lee, Sanghyeon Baeg

    • Resumen

    págs. 26-36

    

  • Thermal performance modeling of loop heat pipes with flat evaporator for electronics cooling

    I. Gabsi, Samah Maalej, Mohamed Chaker Zaghdoudi

    • Resumen

    págs. 37-47

    

  • Improving ESD protection of 5 V NMOSFET large array device in 0.4 μm BCD process

    Shao-Chang Huang, Hung-Wei Chen, Jen-Hang Yang, Mi-Chang Chang

    • Resumen

    págs. 48-54

    

  • Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints

    Jianfeng Li, Jingru Dai, Christopher Mark Johnson

    • Resumen

    págs. 55-65

    

  • FPGA-based design of advanced BMS implementing SoC/SoH estimators

    Virender Kumar, Neeta Khare, P.K. Chaturvedi

    • Resumen

    págs. 66-74

    

  • Cooling performance and characteristics of metal piezoelectric fans in a heat sink-equipped handheld projector

    Jin-Cherng Shyu, Shu-Kai Jheng

    • Resumen

    págs. 75-87

    

  • Stability of miniaturized non-trimmed thick- and thin-film resistors

    Tibor Rovensky, Alena Pietrikova, Igor Vehec, Lubomir Livovsky

    • Resumen

    págs. 88-94

    

  • Stability of low ohmic thick-film resistors under pulsed operation

    Arkadiusz Dąbrowski, Andrzej Dziedzic

    • Resumen

    págs. 95-104

    

  • Investigation of enhanced low dose rate sensitivity in SiGe HBTs by 60Co γ irradiation under different biases

    Jin-xin Zhang, Qi Guo, Hong-Xia Guo, Wu Lu, Chaohui He, Xin Wang, Pei Li Lin, Lin Wen

    • Resumen

    págs. 105-111

    

  • Energy-Delay-FIT Product to compare processors and algorithm implementations

    V. Fratin, D. Oliveira, P. Navaux, L. Carro, P. Rech

    • Resumen

    págs. 112-120

    

  • Optical coupling with flexible polymer waveguides for chip-to-chip interconnects in electronic systems

    Krzysztof Nieweglowski, Lukas Lorenz, Sebastian Lüngen, Tobias Tiedje, Klaus-Jürgen Wolter, Karlheinz Bock

    • Resumen

    págs. 121-126

    

  • Multistage performance deterioration in n-type crystalline silicon photovoltaic modules undergoing potential-induced degradation

    Yutaka Komatsu, Seira Yamaguchi, Atsushi Masuda, Keisuke Ohdaira

    • Resumen

    págs. 127-133

    

  • Performance evaluation for a novel optoelectronic device for noninvasive monitoring thrombosis

    Ke Zhao, Boan Pan, Zebing Li, Fulin Zhong, Pengbo Wang, Ting Li

    • Resumen

    págs. 134-139

    

  • A design and qualification of LED flip Chip-on-Board module with tunable color temperatures

    Jiajie Fan, Jianwu Cao, Chaohua Yu, Cheng Qian, Xuejun Fan, Guoqi Zhang

    • Resumen

    págs. 140-148

    

  • Understanding chromaticity shifts in LED devices through analytical models

    J. Lynn Davis, Karmann C. Mills, Georgiy Bobashev, Kelley J. Rountree, Michael Lamvik, Robert Yaga, Cortina Johnson

    • Resumen

    págs. 149-156

    

  • Investigation and impact of LDD variations on the drain disturb in normally-on SONOS NOR flash device

    Zhaozhao Xu, Donghua Liu, Wei Xiong, Jun Hu, Wenting Duan, Hualun Chen, Wensheng Qian, Weiran Kong, Shichang Zou

    • Resumen

    págs. 157-162

    

  • FFT analysis of temperature modulated semiconductor gas sensor response for the prediction of ammonia concentration under humidity interference

    Lukasz Wozniak, Pawel Kalinowski, Grzegorz Jasinski, Piotr Jasinski

    • Resumen

    págs. 163-169

    

  • The effects of precipitation strengthening and solid solution strengthening on strain rate sensitivity of lead-free solders: Review

    Shiqian Liu, Stuart McDonald, Keith Sweatman, Kazuhiro Nogita

    • Resumen

    págs. 170-180

    

  • Physics-based modeling of TID induced global static leakage in different CMOS circuits

    Gennady I. Zebrev, Vasily V. Orlov, Maxim S. Gorbunov, Maxim G. Drosdetsky

    • Resumen

    págs. 181-186

    

  • A new health estimation model for CNC machine tool based on infinite irrelevance and belief rule base

    Xiaojing Yin, Bangcheng Zhang, Zhijie Zhou, Xiaoxia Han, Zhanli Wang, Guanyu Hu

    • Resumen

    págs. 187-196

    

  • Effective decapsulation of copper wire-bonded microelectronic devices for reliability assessment

    Subramani Manoharan, Chandradip Patel, Patrick McCluskey, Michael Pecht

    • Resumen

    págs. 197-207

    

  • In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging

    Ibrahim Khalilullah, Talukder Reza, Liangbiao Chen, Mark Placette, A.K.M. Monayem H. Mazumder, Jiang Zhou, Jiajie Fan, Cheng Qian, Guoqi Zhang, Xuejun Fan

    • Resumen

    págs. 208-214

    

  • Auxiliary power unit failure prediction using quantified generalized renewal process

    Yujie Zhang, Lulu Wang, Shaonian Wang, Peng Wang, Haitao Liao, Yu Peng

    • Resumen

    págs. 215-225

    

  • Improvement of SiO2/4H-SiC Interface properties by post-metallization annealing

    Y.M. Lei, H. Wakabayashi, K. Tsutsui, H. Iwai, H. Furuhashi, S. Tomohisa, Soji Yamakawa, K. Kakushima

    • Resumen

    págs. 226-229

    

  • Investigation on nano-reinforced solder paste after reflow soldering part 1: Effects of nano-reinforced solder paste on melting, hardness, spreading rate, and wetting quality

    Srivalli Chellvarajoo, M.Z. Abdullah

    • Resumen

    págs. 230-237

    

  • Reliability analysis of vibrating electronic assemblies using analytical solutions and response surface methodology

    Mohammad A. Gharaibeh

    • Resumen

    págs. 238-247

    

  • Effect of lanthanum silicate interface layer on the electrical characteristics of 4H-SiC metal-oxide-semiconductor capacitors

    Y.M. Lei, H. Wakabayashi, K. Tsutsui, H. Iwai, M. Furuhashi, S. Tomohisa, Soji Yamakawa, K. Kakushima

    • Resumen

    págs. 248-252