Microelectronics reliability

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  Año 2019, Número 92

  • Phase field simulation of microstructural evolution and thermomigration-induced phase segregation in Cu/Sn58Bi/Cu interconnects under isothermal aging and temperature gradient

    S.B. Liang, C.B. Ke, J.Q. Huang, M.B. Zhou, X.P. Zhang

    • Resumen

    págs. 1-11

    

  • Effect of alternating current (AC) stressing on the microstructure and mechanical properties of low-silver content solder interconnect

    Ze Zhu, Yan-Cheong Chan, Fengshun Wu

    • Resumen

    págs. 12-19

    

  • Evolution of microstructure of Lead free cu/Sn solders and copper oxide phase precipitation in Cu3Sn intermetallic during thermal cycling

    Yousra Bettahi, Caroline Richard

    • Resumen

    págs. 20-26

    

  • Research on performance of an integrated component with the three-electrode planar switch and the exploding foil bridge

    Jiao Li, Qingjie Jiao, Enyi Chu, Honghai Tong, Mi Zhou, Ying Wang, Guosheng Qin

    • Resumen

    págs. 27-33

    

  • Study on the destruction mechanism caused by dynamic avalanche in GCTs

    Wuhua Yang, Cailin Wang, Jing Yang

    • Resumen

    págs. 34-41

    

  • Over frequency control of photovoltaic inverters in an island microgrid

    Cheng-Ting Hsu, Tsun-Jen Cheng, Hung-Ming Huang, Yih-Der Lee, Yung-Ruei Chang, Jheng-Lun Jiang

    • Resumen

    págs. 42-54

    

  • Online condition monitoring of IGBT modules using current-change rate identification

    M.H. Mohamed Sathik, S. Prashanth, F. Sasongko, Josep Pou Félix

    • Resumen

    págs. 55-62

    

  • Effect of plasma treatment on adhesion strength and moisture absorption characteristics between epoxy molding compound/silicon chip (EMC/chip) interface

    Gyung-Hwan Oh, Sung-Jun Joo, Jae-Woo Jeong, Hak-Sung Kim

    • Resumen

    págs. 63-72

    

  • Non-invasive soft breakdown localisation in low k dielectrics using photon emission microscopy and thermal laser stimulation

    N. Herfurth, K.-C. Wu, A. Beyreuther, T. Nakamura, I. De Wolf, M. Simon-Najasek, F. Altmann, K. Croes, C. Boit

    • Resumen

    págs. 73-78

    

  • Galvanic corrosion behavior at the Cu-Al ball bond interface: Influence of Pd addition and chloride concentration

    Yuelin Wu, Scott Calabrese Barton, Andre Lee

    • Resumen

    págs. 79-86

    

  • Power switch failures tolerance of a photovoltaic fed three-level boost DC-DC converter

    Driss Oulad-Abbou, Said Doubabi, Ahmed Rachid

    • Resumen

    págs. 87-95

    

  • Prognostics of IGBT modules based on the approach of particle filtering

    Yizhou Lu, Aris Christou

    • Resumen

    págs. 96-105

    

  • Reliability analysis through linearity and harmonic distortion of a dual-material-gate asymmetric underlapped DGMOSFET

    Rahul Das, Arpan Dasgupta, Atanu Kundu

    • Resumen

    págs. 106-113

    

  • Remaining useful life prediction of aviation circular electrical connectors using vibration-induced physical model and particle filtering method

    Bo Sun, Yu Li, Zili Wang, Yi Ren, Qiang Feng, Dezhen Yang, Mingsheng Lu, Xueyong Chen

    • Resumen

    págs. 114-122

    

  • Metallized film capacitors used for EMI filtering: A reliability review

    Nathan Valentine, M.H. Azarian, Michael Pecht

    • Resumen

    págs. 123-135

    

  • Optimization of an Artificial Neural Network System for the Prediction of Failure Analysis Success

    Lin Zhao, S.H. Goh, Y.H. Chan, B.L. Yeoh, Hao Hu, M.H. Thor, Alan Tan, Jeffery Lam

    • Resumen

    págs. 136-142

    

  • Contactless parametric characterization of bandgap engineering in p-type FinFETs using spectral photon emission

    A. Beyreuther, I. Vogt, N. Herfurth, T. Nakamura, G.G. Fischer, B. Motamedi, C. Boit

    • Resumen

    págs. 143-148

    

  • Single event effects in commercial FRAM and mitigation technique using neutron-induced displacement damage

    Jia-nan Wei, Hong-Xia Guo, Feng-qi Zhang, Chaohui He, An-an Ju, Yong-hong Li

    • Resumen

    págs. 149-154

    

  • Reliability issue related to dielectric charging in capacitive micromachined ultrasonic transducers: A review

    Junaid Munir, Quratul Ain, Hyunjoo Jenny Lee

    • Resumen

    págs. 155-167

    

  • On the cumulative distribution function of the defect centric model for BTI reliability

    D. Nouguier, G. Pananakakis, X. Federspiel, M. Rafik, D. Roy, G. Ghibaudo

    • Resumen

    págs. 168-171

    

  • High sensitivity detection of ultrasonic signal for nondestructive inspection using pulse compression method

    Hiroki Mitsuta, Kaoru Sakai

    • Resumen

    págs. 172-178

    

  • Resolving trapping effects by scanning microwave microscopy

    S. Hommel, N. Killat, T. Schweinboeck, A. Altes, F. Kreupl

    • Resumen

    págs. 179-181