págs. 1-1
págs. 1-4
págs. 5-19
págs. 20-31
Growth competition between layer-type and porous-type Cu3Sn in microbumps
David T. Chu, Yi-Cheng Chu, Jie-An Lin, Yi-Ting Chen, Chun-Chieh Wang, Yen-Fang Song, Cheng-Cheng Chiang, Chih Chen, K.-N. Tu
págs. 32-37
Thermo-mechanical reliability analysis of a RF SiP module based on LTCC substrate
Cheng Chen, Fengze Hou, Fengman Liu, Qian She, Liqiang Cao, Lixi Wan
págs. 38-47
págs. 48-58
págs. 59-68
págs. 69-78
págs. 79-90
págs. 91-95
págs. 96-103
Stress imaging in structural challenging MEMS with high sensitivity using micro-Raman spectroscopy
Peter Meszmer, Raul D. Rodriguez, Evgeniya Sheremet, D.R.T. Zahn, Bernhard Wunderle
págs. 104-110
Harmonic distortion analysis of triple gate SOI nanowire MOSFETS down to 100 K
B.C. Paz, R.T. Doria, M. Casse, Sylvie Barraud, G. Reimbold, M. Vinet, O. Faynot, M. Pavanello
págs. 111-118
págs. 119-123
págs. 124-135
Improved reliability characteristics of Ge MOS devices by capping Hf or Zr on interfacial layer
Yan-Lin Li, Kuei-Shu Chang-Liao, Yu-Wei Chang, Tse-Jung Huang, Chen-Chien Li, Zhao-Chen Gu, Po-Yen Chen, Tzung-Yu Wu, Jiayi Huang, Fu-Chuan Chu, Shih-Han Yi
págs. 136-139
págs. 140-148
Analysis of deep level defects in bipolar junction transistors irradiated by 2 MeV electrons
Yao Ma, Pengfei Xu, Mingyue Guan, Filippo Boi, Gao Bo, Ming Gong, Xue Wu, Yuxin Wang, Hua Wang, ZengQiang Niao
págs. 149-152
págs. 153-165
Using scanning acoustic microscopy and LM-BP algorithm for defect inspection of micro solder bumps
Fan Liu, Lei Su, Mengying Fan, Jian Yin, Zhenzhi He, Xiangning Lu
págs. 166-174
The phenomenon of tin pest: A review
págs. 175-192
págs. 193-200
Aihua Dong, Javier A. Salcedo, Srivatsan Parthasarathy, Yuanzhong Zhou, Sirui Luo, Jean-Jacques Hajjar, Juin J. Liou
págs. 201-205
págs. 206-220
págs. 221-230
págs. 231-238
págs. 239-247
págs. 248-256
Phase-change immersion cooling high power light emitting diodes and heat transfer improvement
Xue Kang, Yiping Wang, Qunwu Huang, Yong Cui, Chen Wang, Chen Wen, Jiangyang Fan
págs. 257-264
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