Periodo de publicación recogido
|
|
|
Experimental design for verification and validation of harmonic vibration control systems
J. Wang
Noise Control Engineering Journal, ISSN 0736-2501, Vol. 69, Nº. 5, 2021, págs. 460-465
J. Huang, Ranier Clement, Z. Sun, J. Wang, W. Zhang
International journal of advanced manufacturing technology, ISSN 0268-3768, Vol. 65, Nº. 5-8, 2013, págs. 1111-1124
CHMM for tool condition monitoring and remaining useful life prediction.
M. Wang, J. Wang
International journal of advanced manufacturing technology, ISSN 0268-3768, Vol. 59, Nº. 5-8, 2012, págs. 463-472
Effects of an ultrasonically excited TIG arc on CLAM steel weld joints.
X. Chen, Z. Shen, J. Wang, J. Chen, Y. Lei, Q. Huang
International journal of advanced manufacturing technology, ISSN 0268-3768, Vol. 60, Nº. 5-8, 2012, págs. 537-544
Rapid parametric design methods for shoe-last customization.
J. Wang, H. Zhang, G. Lu, Z. Liu
International journal of advanced manufacturing technology, ISSN 0268-3768, Vol. 54, Nº. 1-4, 2011, págs. 173-186
Geometric decomposition of 3D surface meshes using Morse theory and region growing.
J. Wang, Z. Yu
International journal of advanced manufacturing technology, ISSN 0268-3768, Vol. 56, Nº. 9-12, 2011, págs. 1091-1104
L. Ma, X. Jiang, J. Wang, Z. Xu, Z. Li
International journal of advanced manufacturing technology, ISSN 0268-3768, Vol. 57, Nº. 9-12, 2011, pág. 1259
RFID-enabled tracking in flexible assembly line.
International journal of advanced manufacturing technology, ISSN 0268-3768, Vol. 46, Nº. 1-4, 2010, págs. 351-360
A dual-stage control system for high-speed, ultra-precise linear motion.
Y. Song, J. Wang, K. Yang, W. Yin, Y. Zhu
International journal of advanced manufacturing technology, ISSN 0268-3768, Vol. 48, Nº. 5-8, 2010, págs. 633-644
Application of memetic algorithm in assembly sequence planning.
L. Gao, W. Qiang, X. Li, J. Wang
International journal of advanced manufacturing technology, ISSN 0268-3768, Vol. 49, Nº. 9-12, 2010, págs. 1175-1184
Interface integral BEM for solving multi-medium heat conduction problems.
X.-W. Gao, J. Wang
Engineering analysis with boundary elements, ISSN 0955-7997, Vol. 33, Nº. 4, 2009, págs. 539-546
Optimization method with large leap steps for job shop scheduling.
Y.M. Wang, H.L. Yin, J. Wang, K.D. Qin, Y. Chen
International journal of advanced manufacturing technology, ISSN 0268-3768, Vol. 43, Nº. 9-10, 2009, págs. 1018-1023
High-precision assembly automation based on robot compliance.
H. Chen, J. Wang, G. Zhang, T. Fuhlbrigge, S. Kock
International journal of advanced manufacturing technology, ISSN 0268-3768, Vol. 45, Nº. 9-10, 2009, págs. 999-1006
Chip formation analysis in micromilling operation.
J. Wang, Y. Gong, G. Abba, J.F. Antoine, J. Shi
International journal of advanced manufacturing technology, ISSN 0268-3768, Vol. 45, Nº. 5-6, 2009, págs. 430-447
Two-stage hot-carrier degradation behavior of 0.18 µm 18 V n-type DEMOS and its recovery effect.
C. Gao, J. Wang, L. Wang, Andrew Yap, H. Li
Microelectronics reliability, ISSN 0026-2714, Vol. 49, Nº. 1, 2009, págs. 8-12
Temperature-dependent stress-induced voiding in dual-damascene Cu interconnects.
Z. Wu, Y. Yang, C. Chai, Y. Li, J. Wang, J. Liu, B. Liu
Microelectronics reliability, ISSN 0026-2714, Vol. 48, Nº. 4, 2008, págs. 578-583
L. Ma, X. Jiang, J. Wang, Z. Xu, Z. Li
International journal of advanced manufacturing technology, ISSN 0268-3768, Vol. 32, Nº. 9-10, 2007, págs. 990-998
Transmission of point-line meshing gear.
Q. Luo, H. Li, J. Wang, Y. Zhang, H. Huang
International journal of advanced manufacturing technology, ISSN 0268-3768, Vol. 33, Nº. 9-10, 2007, págs. 845-855
Design creativity in product innovation
Y. Li, J. Wang, X. Li, W. Zhao
International journal of advanced manufacturing technology, ISSN 0268-3768, Vol. 33, Nº. 3-4, 2007, págs. 213-222
Printed circuit board recycling process and its environmental impact assessment.
D. Xiang, P. Mou, J. Wang, G. Duan, H.C. Zhang
International journal of advanced manufacturing technology, ISSN 0268-3768, Vol. 34, Nº. 9-10, 2007, págs. 1030-1036
J. Wang
Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 12, 2007, págs. 1958-1966
Board level drop test and simulation of leaded and lead-free BGA-PCB assembly.
X. Qu, Z. Chen, B. Qi, T. Lee, J. Wang
Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 12, 2007, págs. 2197-2204
A Review of Safety Analysis Methods Applied to the Design Process
J. Wang, T. Ruxton
Journal of Engineering Design, ISSN 0954-4828, Vol. 8, Nº. 2, 1997, págs. 131-152
Esta página recoge referencias bibliográficas de materiales disponibles en los fondos de las Bibliotecas que participan en Dialnet. En ningún caso se trata de una página que recoja la producción bibliográfica de un autor de manera exhaustiva. Nos gustaría que los datos aparecieran de la manera más correcta posible, de manera que si detecta algún error en la información que facilitamos, puede hacernos llegar su Sugerencia / Errata.
© 2001-2024 Fundación Dialnet · Todos los derechos reservados