A.L. Alexsandrov, P.A. Androsenko, V.M. Bedanov, A.M. Bekesheva, E.E. Dagnan, O.E. Dnitrieva, G.V. Gadiyak, V.P. Ginkin, M.S. Ivanov, Zh.L. Korobitsina, T.M. Lukhanova, M.S. Obrekht, A.A. Shinanskiy, V.A. Schveigert, I.V. Schveigert, E.G. Tishkovsky, Yu.P. Zhydkov
In this paper the MOPIT system for the simulation of devices and manufacturing processes is presented. The MOPIT system is meant for the simulation of the following semiconductor processing : ion implantation of impurities , diffusion , radiation enhanced diffusion , thermal oxidation of silicon , molecular‐beam epitaxy, plasma‐chemical etching and deposition, cross‐sectional profile evolution of trench in plasma‐etching and deposition; as well as the following devices: MOS‐structures , high‐voltage diode, element of memory, charge accumulation in a sub‐gate dielectric.
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