Y. Depeursinge, L. Guex, J.M. Moret, P. Weiss
We have simulated the technological processes for the well formation in CMOS technology. The general problem of coupled impurities diffusion under oxidizing conditions has been treated by the finite‐element method. The obtained results have been compared to measured profiles. The study of the influence of the technological parameters on the well's structures allowed us to optimize the lateral diffusion, as well as the effects of the field oxidation.
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