Resumen de Influence of sample preparation on intrinsic stresses inside a model Chip - First results of partial decapsulation
T. Schaffus, P. Albert, W. Breuer, D. Debie, M. Graml, C. Hollerith, F. Kroninger, W. Mack, H. Pfaff, M. Schaffus, J. Walter
The given project is to benchmark typical preparation methods under the aspect of the influence of initial intrinsic stresses inside electronic components. Micro milling - and laser-decapsulation in combination with plasma etching were chosen as preparation methods. Raman spectroscopy has been applied as well as the piezo resistive read out on a specifically designed model stress monitoring chip. The results of the analysis at each manufacturing step of the model chip and the first investigations of partial decapsulation are presented.
