The given project is to benchmark typical preparation methods under the aspect of the influence of initial intrinsic stresses inside electronic components. Micro milling - and laser-decapsulation in combination with plasma etching were chosen as preparation methods. Raman spectroscopy has been applied as well as the piezo resistive read out on a specifically designed model stress monitoring chip. The results of the analysis at each manufacturing step of the model chip and the first investigations of partial decapsulation are presented.
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