Resumen de Simulation study on thermo-fatigue failure behavior of solder joints in package-on-package structure
Zhi-Hao Zhang, Xi-Shu Wang, Huai-Hui Ren, Su Jia, Hui-Hui Yang
Abstract In this work, the simulating analysis of PoP structure under the temperature range from 0 °C to 125 °C is carried out using direct thermal-cycle analysis and Coffin-Manson method. The results show that the maximum accumulating inelastic hysteresis energy appears on the solder ball in the bottom fine-pitch ball grid array (FBGA) structure. The thermal-fatigue crack initiates in the two symmetrical corners of solder ball in FBGA structure. The thermal-fatigue damage evolves fast in the outer row corner's balls then slowly propagates into the inner row balls in FBGA structure. By analyzing the failure data of solder balls, a thermal-fatigue failure criterion is defined where the critical failure probability value is about 80%.
