Development and assembly of Radio Frequency Module using components with SMD technology for educational purposes
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Rodrigo Luiz Ximenes [1] ; Gabriel Duarte Meceneiro [1] ; Bruno Tavares de Souza Conrado [1] ; Leonardo Lorenzo Bravo Roger [1] ; Talía Simões dos Santos [1]
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[1] University of Campinas
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- Localización: Latin-American Journal of Physics Education, ISSN-e 1870-9095, Vol. 11, Nº. 1, 2017
- Idioma: inglés
- Enlaces
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Resumen
Wireless communications devices such as mobile phones, tablets, laptops, routers, wireless sensor networking modules, etc. that are subject to a dynamic market that increasingly requires miniaturization. One of the strategies followed by technology to respond to this requirement, has been operating on increasingly radio frequencies, but higher the operating frequency, greater the complexity, not only the theoretical project, but especially the assembly of circuit boards of such devices. Expensive and complex robotic machines are used in industry for soldering components on the boards of the radio frequency circuit. This paper shows the step-by-step development of a radiofrequency module for assembly using an inexpensive soldering furnace developed for such. The experience is described in order to disclose a solution that can be useful for carrying out practical projects in university teaching laboratories, unable to acquire professional assembly machines, due to its high cost.
