Fiberboard manufactured without resin using the fenton reaction

• JUAN RIQUELME-VALDÉS ^[1] ; ESTEBAN RAMÍREZ ^[2] ; DAVID CONTRERAS ^[1] ; JUANITA FREER ^[1] ; JAIME RODRÍGUEZ ^[1]
  1. [1] Universidad de Concepción

     Universidad de Concepción

     Comuna de Concepción, Chile

     
  2. [2] MASISA S.A. División Tableros
• Localización: Journal of the Chilean Chemical Society (Boletín de la Sociedad Chilena de Química), ISSN-e 0717-6309, ISSN 0366-1644, Vol. 53, Nº. 4, 2008, págs. 1722-1725
• Idioma: inglés
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• Resumen

  • Resin-free fiberboards were manufactured using industrial fiber from Pinus radiata activated by an oxidative treatment using the Fenton reaction (H(2)0(2)/ Fe(II)). A multivariate analysis was used to study the effect of fiber moisture content (MC), press temperature (T), and the H(2)0(2)/Fe(II) ratio on the board internal bond strength (IB). Using response surface methodology, a set of máximum IB conditions was obtained. Validation of these conditions which included 25% MC, 170°C press temperature and a H(2)0(2)/Fe(II) relation of 25 produced an optimal board with an IB strength of 0.888 MPa. Without the addition of sizing agents or other additives, the dimensional stability properties were 16% of thickness swell and 40% of the water absorption of control boards.