The Interface Crack Problem of Bonded Piezoelectric and Elastic Half-Space Under Transient Electromechanical Loads

• Autores: S.A. Meguid, X. Zhao
• Localización: Journal of applied mechanics, ISSN 0021-8936, Vol. 69, Nº. 3, 2002, págs. 244-253
• Idioma: inglés
• Texto completo no disponible (Saber más ...)
• Resumen

  • The interface crack problem of bonded piezoelectric and elastic half-space under transient electromechanical loads is considered. Both the permeable and impermeable boundary conditions are examined and discussed. Based on the use of integral transform techniques, the problem is reduced either to a singular integral equation for the permeable boundary condition or to two coupled singular integral equations for the impermeable boundary condition, which can be solved using Chebyshev polynomial expansions. Numerical results are provided to show the effect of the applied electric fields, the electric boundary conditions along the crack faces and a free surface on the resulting dynamic stress intensity factor and electric displacement intensity factor. ©2002 ASME