Numerical simulation of EWOD on a printed circuit board for cleanroom-less digital fluidic manufacturing applications

• Reza Hadjiaghaie Vafaie ^[1] ; Hossein Dehganpour ^[2] ; Abolfazl Moradpour ^[2]
  1. [1] University of Bonab

     University of Bonab

     Irán

     
  2. [2] Sahand University of Technology

     Sahand University of Technology

     Irán

     
• Localización: Compel: International journal for computation and mathematics in electrical and electronic engineering, ISSN 0332-1649, Vol. 38, Nº 1, 2019, págs. 119-137
• Idioma: inglés
• Enlaces
  • Texto completo
• Resumen

  • Purpose – Digital microfluidic devices have been demonstrated to have great potential for a wide range of applications. These devices need expensive photolithography process and clean room facilities, while printed circuit board (PCB) technology provides high configurability and at low cost. This study aims to investigate the mechanism of electrowetting-on-a-dielectric (EWOD) on PCB by solving the multiphysics interaction between fluid droplet and electric field. The performance of system will be improved by inducing an efficient electric field inside the droplet.

    Design/methodology/approach – To induce an electric field inside the droplet on a PCB and change the initial contact angle, the mechanism of EWOD is studied based on energy minimization method and a set of simulations are carried out by considering multiphysics interaction between the fluid droplet and external electric field. The performance of EWOD on a PCB system is investigated using different electrode structures.

    Findings – Surface tension plays an efficient role in smaller sizes and can be used to move and control a fluid droplet on a surface by changing the interfacial surface tension. EWOD on a PCB system is studied. and it revealed that any change in electric field affects the droplet contact angle and as a result droplet deformation and movement. The electrode pattern is an important parameter which could change the electric potential distribution inside the droplet. Array of electrodes with square, zigzag interdigitated and crescent shapes are studied to enhance the EWOD force on a PCB substrate. Based on the results, the radial shape of the crescent electrodes keeps almost the same actuated contact line, applies uniform force on the droplet periphery and prevents the droplet from large deformation. A droplet velocity of 0.6 mm/s is achieved by exciting the crescent electrodes at 315 V. Furthermore, the behavior of system is characterized for process parameters such as actuation voltage, dielectric constant of insulator layer, fluidic material properties and the resultant velocity and contact angle. The study of contact angle distribution and droplet motion revealed that it is helpful to generate EWOD mechanism on a PCB which does not need more complicated fabrication processes.

    Originality/value – The ability to handle and manipulate the droplets is very important for chemistry onchip analysis such as immunoassay chips. Furthermore, a PCB-based electrowetting-on-dielectric device is of high interest because it does not need cleanroom facilities and avoids additional high-cost fabrication processes.

    In the present research, the EWOD mechanism is studied on a PCB by using different electrode patterns.