Shear strength and fracture surface analysis of Sn58Bi/Cu solder joints under a wide range of strain rates

• Autores: Yongqiang Wan, Shuang Li, Xiaowu Hu, Yu Qiu, Tao Xu, Yulong Li, Xiongxin Jiang
• Localización: Microelectronics reliability, ISSN 0026-2714, Nº. 86, 2018, págs. 27-37
• Idioma: inglés
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• Resumen

  • The influences of the strain rate on the shear strength and failure mode of Sn58Bi/Cu solder joints were investigated. After reflowing, some Kirkendall voids were observed at the neighborhood of the Cu3Sn/Cu interface or in the inner Cu3Sn layer. In addition, another type of void could also be observed inside the Sn58Bi eutectic solders, and its size was much larger than that of Kirkendall voids. Some Bi particles were obviously found to segregate at the interface between the Cu-Sn IMC and the Sn58Bi solder. The single lap shear test results indicated that the strain rate had an important influence on the shear strength and failure mode of Sn58Bi/Cu solder joints. The shear strength of joints demonstrated increment at first and then decrement as the strain rate increased from 3.33 × 10−4 s−1 to 3.33 s−1. It was observed that all Sn58Bi/Cu solder joints broke in a mixed-type fracture mode under a wide range of strain rates. Additionally, more broken IMC grains were exposed on the fracture face and more fracture occurred within the IMC layer with increasing strain rate. Furthermore, the fracture path gradually moved from the solder side to the inner IMC side as the strain rate increased.