Haoran Ma, Anil Kunwar, Jun Chen, Lin Qu, Yunpeng Wang, Xueguan Song, Peter Råback, Haitao Ma, Ning Zhao
In microelectronic circuit exposed to humid environment, the growth phenomenon of dendritic deposits due to the electrochemical migration (ECM) of metallic ions, generates a serious reliability issue. ECM of Sn and Zn ions in deionized water with Sn-9Zn electrodes, has been in-situ studied at gap potentials of 3 and 5 V. At 3 V, tin ions (with 15.61 wt%) dominate the composition of metallic dendrites whereas Zn ions (with 20.99 wt%) show greater presence in the experiment with 5 V. The Nernst-Planck transport equation has been solved using finite element method in order to describe the kinetics of ECM of Sn2+ and Zn2+ ions. The composition of resultant dendrites is governed by the competition between advection rate, transport time scale and anodic surface concentration of metallic species.
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