Warpage simulation and experimental verification for 320 mm × 320 mm panel level fan-out packaging based on die-first process

• Autores: Meiying Su, Liqiang Cao, Tingyu Lin, Feng Chen, Jun Li, Cheng Chen, Gengxin Tian
• Localización: Microelectronics reliability, ISSN 0026-2714, Nº. 83, 2018, págs. 29-38
• Idioma: inglés
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• Resumen

  • Warpage for 320 mm × 320 mm panel level fan-out packaging based on die-first process was investigated by both simulation and experimental approaches. In the present paper, a simple and efficient FEA (Finite Element Analysis) method based on shell element was introduced. Finite element models were built by using the software of Ansys products to predict and analysis the warpage for feasibility of large panel fan-out packaging technology in aspect of material, package geometries, package size, process conditions and metal density. In order to verify the accuracy and the precision of the simulation method, test vehicle with dies was fabricated by using low cost ‘die first (face down)’ fan-out technology. Warpage of the test vehicle was measured by using Shadow Moiré method. The simulated warpage result and the experimental one exhibit good consistency.