Fundamental-frequency and load-varying thermal cycles effects on lifetime estimation of DFIG power converter

• Autores: G. Zhang, D. Zhou, J. Yang, Frede Blaabjerg
• Localización: Microelectronics reliability, ISSN 0026-2714, Nº. 76-77, 2017, págs. 549-555
• Idioma: inglés
• Texto completo no disponible (Saber más ...)
• Resumen

  • Abstract In respect to a Doubly-Fed Induction Generator (DFIG) system, its corresponding time scale varies from microsecond level of power semiconductor switching to second level of the mechanical response. In order to map annual thermal profile of the power semiconductors, different approaches have been adopted to handle the fundamental-frequency thermal cycles and load-varying thermal cycles. Their effects on lifetime estimation of the power device in the Back-to-Back (BTB) power converter are evaluated.