Lifetime of power electronics interconnections in accelerated test conditions: High temperature storage and thermal cycling

• Autores: Wissam Sabbah, Faical Arabi, Oriol Avino-Salvado, Cyril Buttay, Loïc Théolier, Hervé Morel
• Localización: Microelectronics reliability, ISSN 0026-2714, Nº. 76-77, 2017, págs. 444-449
• Idioma: inglés
• Texto completo no disponible (Saber más ...)
• Resumen

  • Abstract We investigate the effect of three testing conditions (thermal shock, Rapid Temperature Change – RTC – and high temperature storage) on the interconnects of a power electronic module. In particular, the mechanical strength of thick aluminium wirebonds is investigated and shows that while it is not affected by storage at 230 °C, it is much more sensitive to thermal cycling. Shock tests are found to be especially severe, despite having a smaller temperature swing than RTC. Regarding the die attach, no noticeable reduction in mechanical strength is found, regardless of the ageing conditions, and despite clear micro-structural evolutions.