Resumen de Thermal impedance measurement of integrated inductors on bulk silicon substrate
M. Kałuża, B. Wiecek, G. de Mey, A.T. Hatzopoulos, V. Chatziathanasiou
Abstract The article presents the results of transient thermal measurements of a coil integrated in a silicon chip. Based on those measurements and using numerical procedures, thermal impedance, time constant distribution and structure functions were obtained. Next, using simple physical models of heat transfer phenomena, the 3 major time constants of the device under test were calculated, compared with measurement results and explained physically.
