Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications

• Autores: Byung-Suk Lee, Yong-Ho Ko, Jung-Hwan Bang, Chang-Woo Lee, Sehoon Yoo, Jun-Ki Kim, Jeong-Won Yoon
• Localización: Microelectronics reliability, ISSN 0026-2714, Nº. 71, 2017, págs. 119-125
• Idioma: inglés
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• Resumen

  • Abstract The mechanical strength of Sn-3.0Ag-0.5Cu (SAC305) and Au-20Sn solder joints and their interfacial reaction with a Ni-plated ceramic substrate were evaluated to assess their suitability for use as die attach materials in power module applications. The compatibility between the two solder alloys and the Ni substrate was assessed during isothermal long-term aging, while the mechanical strength of the two solder joints was measured by die shear testing. A higher intermetallic compound (IMC) growth rate and Ni consumption rate was observed in the SAC305 solder joint, with the formation of a thick IMC layer and weak interface resulting in brittle fracture. The Au-20Sn solder joint, on the other hand was found to exhibit superior high temperature interfacial stability and joint strength.