Temporal and frequency characteristic analysis of margin-related failures caused by an intermittent nano-scale fracture of the solder ball in a BGA package device

• Autores: Hosung Lee, Sanghyeon Baeg, Nelson Hua, ShiJie Wen
• Localización: Microelectronics reliability, ISSN 0026-2714, Nº. 69, 2017, págs. 88-99
• Idioma: inglés
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