Predicting non-Fickian moisture diffusion in EMCs for application in micro-electronic devices

• Autores: M. Barink, A. Mavinkurve, J. Janssen
• Localización: Microelectronics reliability, ISSN 0026-2714, Nº. 62, 2016, págs. 45-49
• Idioma: inglés
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• Resumen

  • Abstract This study made an attempt to predict the temperature-dependent moisture diffusion of an epoxy molding compound with 3 different diffusion models: Fickian, dual stage and Langmuir diffusion. The Langmuir model provided the best prediction of the moisture diffusion when simulating the input experiments. Beyond the temperature range of the input experiments, the Langmuir model was still able to provide a fair prediction. Hence, the Langmuir model also provides better predictions for the moisture distribution in general. This allows for building on existing prediction models and enabling simulations of reliability tests like UHST.