Long-Chin Lin, Jau-Woie Chang, Leii H. Chang, Chih-Hung Tsai, Rong-Kwei Li
Enhancing production efficiency in the IC packaging manufacturing heavily relies on acquiring shop floor information and then utilizing it, thereby necessitating the development of a computerized WIP and scheduling system (CWSS). Therefore, this work develops a production model to flexibly define shop floor information in the production flow. The proposed model comprises four modules: operation template setup, general process setup, enhanced bill of manufacturing (EBOMfr) setup, and work-order process setup. To timely handle manufacturing data, this work also proposes a WIP module to monitor and control production flow. Moreover, a scheduling module is constructed with a time-advanced scheme. The primary results of the integration of both modules for the IC packaging industry are discussed as well.
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