Remoción de plástico para blindaje electromagnético en microcircuitos electrónicos.

• Autores: Lidia Vargas, Eduardo Cabrera, Benjamín Valdez Salas, Amparo Oliveros, Roberto Ibarra
• Localización: Ciencias de la Ingeniería y Tecnología Handbook T-VII: Congreso Interdisciplinario de Cuerpos Académicos / coord. por José Miguel Barrón Adame, Marcos Rodríguez Sánchez, Joel Quintanilla Domínguez, 2014, ISBN 978-607-8324-24-8, págs. 94-102
• Idioma: español
• Enlaces
  • Texto Completo Libro (pdf)
• Resumen

  • The manufacture of electronic components continues an increasing trend towards miniaturization and more complex designs. A consequence of taking advantage of full function modules and integration is an increased susceptibility to electromagnetic interference on devices.

    It has been necessary to develop new shielding techniques to protect sensitive electronic devices from any external interference while at the same time preventing any interference being emitted from the device to adversely react with adjacent circuits.

    There was reviewed a shielding in circuit approach consisting in removing a thin top layer of molding compound thru sand blast and a subsequent application of a conductive acrylic paint with silver to create a highly conductive coating to obtain a Faraday's cage. Process ablation alternatives were developed using a laser and plasma cleaning on components with plastic molding compress.